Mass Production Capability
Advanced Microsensors' unique manufacturing capability meets high productivity and volume capacity needs. Our 30,000 square foot, Class 100 clean room is our production and development arena. It is equipped with process cooling water, de-ionized water, clean dry air and nitrogen, and UPS power. Our equipment accommodates 6" wafers.
See a slideshow of our 30,000 sq. ft. cleanroom facility.
Environmental Policy
Advanced
Advanced MicroSensors is committed to ensuring environmental compliance while also
protecting the safety of our employees and the community in which it operates.
We are committed to meeting or exceeding applicable legal and other
requirements.
We will establish, implement, and maintain programs to ensure the
minimization of waste and pollution.
We will establish, implement, and maintain emergency response plans to
minimize any environmental impacts caused by emergency events within our
facility.
We will manage our activities, materials and personnel in a manner that reduces the
environmental impacts associated with the design and
manufacture of MEMS, Tape Heads and Sensors.
We will collect and analyze data to ensure compliance and strive for
continuous improvement of our Environmental Management System.
Quality Control
The high product quality created by our production technology is ensured by statistical process control (SPC). SPC charts are on line for all critical process steps per our control plan. Control limits, specifications and out-of-control rules are linked to the central database. A non-conforming material report is automatically generated when an out-of-specification move is attempted.
Failure Analysis Capability
Our wide range of failure analysis capabilities plays a crucial role in fast problem containment, root cause determination and planning and execution of corrective/preventive actions. Our capabilities include:
- Atomic absorption spectrometer, X-ray fluorescence spectrometer
- Electrochemical analyses - cyclic voltammographic stripping, titration, etc.
- FIB-SEM, EDX-SEM
- Atomic/magnetic force microscope
- VSM, RMM, H-B looper, Quasi-static tester
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Nordiko 9606 multi-target sputtering system.
Wafer-level, automated electrical testing, measuring critical device characteristics of each tape head cluster for shipment.
Customized SPC charts for every process and NIST traceable standard provide outstanding process control and measurement equipment control.
A B-H loop of a permanent magnet material measured by VSM.
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