Services

Wafer Bumping

AMS is currently developing wafer bumping processes for lead-free solder bumps on both bond pads and copper studs. We are also developing gold bumps for applications requiring gold bumps up to 75 microns in height.

Developed for 6-inch wafers, AMS bumping processes are expected to be used by developers and medium volume manufacturers who need fast turnaround and high quality for their custom applications.

Click here to download an Adobe PDF version of the Gold Bump brochure.