Technology

Wet Processing

AMS' wet process technologies produce fairly thick film structures (patterned), flat polished surface and released micro-structures. Our capabilities include:

  • Precision through-mask electrodeposition of metals and alloys
  • Fine pattern selective wet chemical etching
  • Chemical-mechanical polishing (CMP)
  • Release etching of sacrificial layers
  • Supercritical CO2 cleaning

 SEM image showing stacked copper posts

An SEM image showing stacked copper posts produced by precision through-mask electrodeposition process.


flat surface produced by CMP process

A flat surface produced by CMP process. The process conditions are optimized reflecting the combination of materials exposed in the surface.

 MEMS structure produced by DRIE etching

A MEMS structure produced by DRIE etching of Si and wet release etching of a sacrificial SiO2 layer.