Technology

Photolithography

Our photolithography technologies play a key role in our ability to meet critical industry demands, including:

• Constant demand for smaller critical dimensions
• Low cost, high aspect-ratio photoresist patterns and structures atop variable step-height underlayers and reflective substrates to tight tolerances
• Vertically-walled, tapered or undercut photoresist profiles for a variety of subsequent processes to produce new structures

A line-up of I-line and G-line steppers serves various CD demands of customers. AMS uses ASML PAS 5500/80 I-line stepper for sub-micron CDs.

Highly precise metallic components are generated by our photo and other customized process technologies. The photo shows a narrow track NiFe magnetic pole.

An electrically insulated inductive coil in a thin film magnetic head. Our polymeric insulation curing process generates uniform structures with tailored profiles.

A lift-off mask with a controlled undercut profile (cross-sectioned by FIB).